Brief introduction
| model | HongJin-H1800 |
| Specification | 30G/branch |
| characteristic | HongJin-H1800 is a one-component low-temperature fast-curing epoxy resin adhesive. It is mainly used for bonding various plastic products, metal parts, heat-sensitive components, such as memory cards, CCD/CMOS, etc. It can also be used for bonding and reinforcing various active and passive components in PCBA assembly. |
| Applicable Products | Bonding of various metal and non-metallic devices, VCM motor bonding, etc. |
Technical parameter
Attributes | magnitude |
type | epoxy glue |
viscosity（at 25°） | 35000±10000(mPa·s) |
density（g/cm3） | 1.3±0.2 |
hardness（Shaw BrothersD） | 75+/-15 |
Shear force（MPa）（Fe/Fe） | 20Min. |
water absorption | ＜1.0% |
Curing rate | 100% |
surface resistance（Ω） | 1.2×1012 |
Operation time（After opening） | 12H |
Precautions
1、Please store glue at -20 degrees.
2、Warm up the glue at room temperature for 2 hours before use.
3、Before using glue, use it in small quantities to avoid massive problems.
4、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.
5、After dispensing, please strictly follow the conditions recommended in the specification.
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Mail ：sales@szhjtec.com
contact ：吳先生 18688927121
王先生 13332958891
address ：深圳市龍崗區坪地街道教育北路49號5B棟501
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